From 577be96d170bdb3b23625f78523bf58037ba0890 Mon Sep 17 00:00:00 2001 From: Brian Lich Date: Tue, 15 Nov 2016 11:20:29 -0800 Subject: [PATCH] fixed typo --- windows/keep-secure/tpm-recommendations.md | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-) diff --git a/windows/keep-secure/tpm-recommendations.md b/windows/keep-secure/tpm-recommendations.md index 277ad8c4ba..0b34d5a9a8 100644 --- a/windows/keep-secure/tpm-recommendations.md +++ b/windows/keep-secure/tpm-recommendations.md @@ -63,7 +63,7 @@ TPM 2.0 products and systems have important security advantages over TPM 1.2, in - TPM 1.2 implementations vary in policy settings. This may result in support issues as lockout policies vary. - TPM 2.0 lockout policy is configured by Windows, ensuring a consistent dictionary attack protection guarantee. -- While TPM 1.2 parts are discrete silicon components which are typically soldered on the motherboard, TPM 2.0 is available as a **discrete (dTPM)** silicon component in a sinple semiconductor package, an **integrated** component incorporated in one or more semiconductor packages - alongside other logic units in the same package(s) - and as a **firmware (fTPM)** based component running in a trusted execution environment (TEE) on a general purpose SoC. +- While TPM 1.2 parts are discrete silicon components which are typically soldered on the motherboard, TPM 2.0 is available as a **discrete (dTPM)** silicon component in a single semiconductor package, an **integrated** component incorporated in one or more semiconductor packages - alongside other logic units in the same package(s) - and as a **firmware (fTPM)** based component running in a trusted execution environment (TEE) on a general purpose SoC. ## Discrete, Integrated or Firmware TPM?