This commit is contained in:
jdeckerMS
2016-11-15 13:03:24 -08:00
3 changed files with 4 additions and 6 deletions

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@ -21,7 +21,7 @@ author: Mir0sh
***Event Description:***
This event generates when [Kerberos policy](https://technet.microsoft.com/en-us/library/cc782061(v=ws.10).aspx) was changed.
This event generates when [Kerberos](https://msdn.microsoft.com/library/windows/desktop/aa378747.aspx) policy was changed.
This event is generated only on domain controllers.

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@ -63,7 +63,7 @@ TPM 2.0 products and systems have important security advantages over TPM 1.2, in
- TPM 1.2 implementations vary in policy settings. This may result in support issues as lockout policies vary.
- TPM 2.0 lockout policy is configured by Windows, ensuring a consistent dictionary attack protection guarantee.
- While TPM 1.2 parts are discrete silicon components which are typically soldered on the motherboard, TPM 2.0 is available as a **discrete (dTPM)** silicon component in a sinple semiconductor package, an **integrated** component incorporated in one or more semiconductor packages - alongside other logic units in the same package(s) - and as a **firmware (fTPM)** based component running in a trusted execution environment (TEE) on a general purpose SoC.
- While TPM 1.2 parts are discrete silicon components which are typically soldered on the motherboard, TPM 2.0 is available as a **discrete (dTPM)** silicon component in a single semiconductor package, an **integrated** component incorporated in one or more semiconductor packages - alongside other logic units in the same package(s) - and as a **firmware (fTPM)** based component running in a trusted execution environment (TEE) on a general purpose SoC.
## Discrete, Integrated or Firmware TPM?